Multilayer PCB has more than 2 conductive copper levels which mainly are made up of inner layer cores, prepreg tiers and copper foils and they? lso are melted together by means of heat and strain. Lamination process is one of the key to control top quality of multilayer PCB, this process requires specific heating and pressure for specific durations based on materials used to ensure the PCB board is made properly.

The multilayer PCB is the particular development of the particular double sided PCB with increasing difficulty and density associated with components, they permitted the designers to produce highly complicated and compact circuits and further growth of blind in addition to buried via gap technology has pressed these limits actually further.

With typically the requirements of larger precision in various applications, the demands associated with multilayer PCB keep increasing continuously recently. The typical programs of multilayer published circuit boards consist of Computers, Data storage space, Cell phone tranny, GPS technology, satellite systems and therefore on.

A-TECH will be an experienced multilayer PCB manufacturer which often own complete multilayer PCB manufacturing method in house coming from inner layer, vacuum lamination to area finishes, it brings us more advantages in the competition of global market shares for multilayer printed circuit boards on quality, cost and lead period. The proportion regarding multilayer PCB all of us manufactured is even more than 65%.

HDI PCB, the entire brand is High Density Connect PCB, it requires much higher wiring denseness with finer trace and spacing, smaller sized vias and higher connection pad thickness. Blind and smothered vias? design is 1 of their designated feature. HDI PCB are widely applied for Mobile phone, capsule computer, digital camera, GPS, LCD module plus other different area.

A-TECH CIRCUITS provides HDI PCB production services to around the world customers in the particular top quality automotive market, medical computer business, mobile, computing in addition to defense industry.

Currently the advanced HDI technology we used include: “Direct Laser beam Drill”(DLD) is drilling of copper level by direct CO2 laser irradiation, out-do additional laser drilling with conformal cover up, the copper immediate laser drilling has the ability to of providing larger accuracy, better opening quality and much better efficiency for HDI projects. “Copper Filled” for special bunch microvia, “Laser Primary Imaging”(LDI) is particularly designed for good line technology, to eliminate dimensional stableness problem of art caused by ecological and material issues. multilayer pcb